Thermal Interface Material Market 2016: Global Industry Insights, Statistics, Study and forecasts
Global Market Research Report on Thermal Interface Material Market 2016 is a professional and in-depth complete study on the current state of the Thermal Interface Material worldwide.
Today, thermal interface material market has witnessed a significant growth owing to an increasing need for thermal management. Furthermore, thermal management is required to keep the electronic equipment operating smoothly. Besides this, the industry is likely to grow exceptionally worldwide owing to the rising consumption volume. Moreover, the Asia Pacific and North American region are witnessing greater need for thermal management in the medical device industry.
The demand for faster as well as highly sophisticated electronic devices has played a vital role in driving the thermal interface market. In addition, need for energy efficient lighting is driving the market worldwide. Besides this, electrification of the transportation sector is likely to create greater opportunities worldwide. Demand for highly improved and seamless connectivity would also keep the future of the market robust.
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The thermal interface material market is segmented based on application, type and regions. The applications assessed during the study are computers, telecom, medical devices, industrial machinery, consumer durables, and automotive electronics. The types covered in the market research report are greases and adhesives, tapes and films, gap fillers, metallic TIMs, and PCM.
Regions such as North America, Europe, Asia Pacific and LAMEA are likely to witness tremendous growth.The key market players active in the thermal interface material market are Indium Corporation, Wakefield-Vette, Inc., Momentive Performance Materials Inc., Zalman Tech Co., Ltd., Laird Technologies, Dow Corning, Honeywell International and 3M Company.
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