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Global Semiconductor Packaging Materials Market Analysis To Grow At CAGR Of 4.79% by 2020

MarketResearchReports.biz has recently announced the addition of a market study “Global Semiconductor Packaging Materials Market 2016-2020”, is a comparative analysis of the global market.

About Semiconductor Packaging Materials

Semiconductor packages are metal, plastic, and ceramic components which not only protect the fabricated IC on the semiconductor die but also acts as an interconnect between the die and the PCB (printed circuit board). They protect the die from external mechanical impact and corrosion, and also act as electrically conductive interconnects with excellent signal propagation properties. Excess heat in the circuit is not allowed to build up by dissipation through attached heat spreaders. Packaging components vary in dimensions and functionality and mainly are organic substrates, leadframes, bonding wires, encapsulation resins, die attach materials, solder balls, and thermal interface materials, among others. The key customers of these packaging material are fabless semiconductor companies, packaging material suppliers, packaging subcontractors, semiconductor manufacturers, the electronics industry, and the automotive sector.

Technavios analysts forecast the global semiconductor packaging materials market to grow at a CAGR of 4.79% during the period 2016-2020.

Covered in this report

The report covers the present scenario and the growth prospects of the global semiconductor packaging materials market for the period 2016-2020. To calculate the market size and geographical segmentation, the report considers the revenue generated from the sales of different types of packaging based on the type of material, which can be broadly classified as either leadframe based or laminate substrate based.

The market is divided into the following segments based on geography:

Americas

APAC

EMEA

Technavio's report, Global Semiconductor Packaging Materials Market 2016-2020, has been prepared based on an in-depth market analysis with inputs from industry experts. The report covers the market landscape and its growth prospects over the coming years. The report also includes a discussion of the key vendors operating in this market.

Key vendors

Amkor Technology

DuPont

Henkel

Hitachi Chemical

Honeywell

KYOCERA

Toppan Printing

Download sample Copy Of This Report: http://www.marketresearchreports.biz/sample/sample/711537

Other prominent vendors

Alpha Advanced Materials

Applied Materials

ASM Pacific Technology (ASMPT)

BASF

Beijing Doublink Solders

Beijing Kehua New Chemical Technology

Cheil Industries

Duksan Hi-metal

Diehl Metall

Dynacraft

Evergreen Semiconductor Materials

Guangdong Rongtai

Heesung Metal

Heraeus

Ibiden

Indium

IQE

KCC

LG Innotek

Lintec

Lord

Mitsui High-Tec

MK Electron

Nanya PCB

Ningbo Dongsheng IC

Nippon Micrometal

Nitto Denko

Poongsan

Samsung Techwin

Shinko

Shin-Etsu Chemical

Shanghai Sinyang Semiconductor Materials

Sumitomo Metal Mining

Tanaka Denshi Kogyo

Tatsuta Electronic Materials

Xiamen Yonghong Electronics

 

Market driver

Rising demand for polymer adhesive wafer bonding equipment

For a full, detailed list, view our report

 

Market challenge

Fluctuating foreign exchange rates

For a full, detailed list, view our report

 

Market trend

Rapid technological changes

For a full, detailed list, view our report

 

Key questions answered in this report

What will the market size be in 2020 and what will the growth rate be?

What are the key market trends?

What is driving this market?

What are the challenges to market growth?

Who are the key vendors in this market space?

What are the market opportunities and threats faced by the key vendors?

What are the strengths and weaknesses of the key vendors?

Read our latest Press Releases at http://www.marketresearchreports.biz/pressreleases

 

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