Process of Oxide layer deposition in Silicon Wafers
CVD process has multiple application is semiconductor industry. This process is utilized in the design and fabrication of semiconductor devices.
The technique for depositing thin films of oxide on Silicon wafers is known as chemical vapor deposition method. It is a chemical process used to produce high-purity and wafers. The process is often used in the semiconductor industry to produce thin oxide films and fabrication of semiconductor devices. A number of forms of CVD are used for various types of industrial applications.
7 Variants of chemical vapor deposition Process:
In the CVD process, the wafer is exposed to precursor, which react with the substrate surface to fabricate the desired deposit. Materials used in the CVD process include silicon wafers, carbon nanofibers & nanotubes, carbon fiber, silicon-germanium, tungsten, silicon carbide, silicon nitride, silicon dioxide, diamond and titanium nitride. Out of all these material silicon wafer are most easily available and have huge applications in Wafer industry and Integrated Circuits. A Silicon wafer is a thin slice of semiconductor material used in the manufacture of micro devices. There are several wafer suppliers that are available which can provide you quality 4" Silicon Wafers with a thermal oxide layer deposited.
Substances Deposited on Integrated Circuits:
Applications of Chemical Vapor Deposition:
Source: Free Articles from ArticlesFactory.com
ABOUT THE AUTHOR
I have great experience in fabricating silicon wafers and its products. I frequently write informative blogs and articles online to make people aware of the current market and the types of Silicon Wafer available for this industry.