Seamless Steel Deep Processing Deoxy Packaging Technology

Aug 19
20:38

2014

Henary Lee

Henary Lee

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Deoxygenation reaction principle commonly have iron oxide (iron), oxidative enzymes (enzymes), ascorbic acid oxidation, light-sensitive dye oxidation. Currently, most are based on the use of oxygen scavenger iron oxidation.

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This iron-based deoxidizer pouch can be made,Seamless Steel Deep Processing Deoxy Packaging Technology Articles into the packaging, the oxygen concentration falls to 0.01%. General requirements lg iron and oxygen can react 300mL, when used according to the package oxygen permeability select the remaining amount of oxygen and a suitable amount of packaging film. Applications products include candies, dried seafood snacks, cooked meat, rice cakes, pasta, cheese, dried vegetables. In addition to the bags deoxidizer, also containing active iron plastic card into the various labels or packaging. In addition to iron-based oxygen scavenger, enzymes Deoxidizer applications are very wide. Enzymes deoxidizer for pH, Aw, salt content, temperature, and other factors are sensitive to the need to participate in the reaction water, and therefore, the low moisture content in food applications is not effective. However, bottled beer or liquor drinks, this can be made directly Deoxidizer pouch, into the bottle. Alternatively, the enzyme may be fixed on a polypropylene or polyethylene film. There is a class of light-sensitive dye Deoxidizer deoxidizer, this technology is in the top deoxy transparent bag sealed book a small piece of ethyl cellulose membrane (internal photosensitive dye dissolved and singlet oxygen acceptor), when packaging film by light of an appropriate wavelength, the dye molecule will be excited into the environment of the packaging film to oxygen molecules sensitized singlet oxygen, which singlet oxygen molecules react with the receptor molecule is consumed. Australia 02TM is a series of plastic packaging material design, the material of the reactive components or high-energy ultraviolet rendered active after activation, and therefore suitable for processing into a film, sheet, coatings, etc. 02TM containing the test showed that the flexible layer: in the absence of carbon dioxide conditions, mold can be suppressed even under visible light, can prevent the discoloration of ham. After a small diameter thick wall steel pipe after welding, in order to ensure that the weld seam area and near perfect performance with cooling joints have to wait to be transformed into martensite tempered obtained after tempering sorbite organization. If the weld cooled to room temperature martensitic transformation, its hardness will up to HV400 ~ 500, this organization is hard and brittle, with the role of the cooling process analysis set hydrogen and residual stress after welding, there are cracks Danger. Therefore, the thickness of the small diameter and thick wall steel pipe welded joints is more than 6mm allowed to cool to below 100  tempered before, but directly from the preheating temperature must not be allowed (300 ~ 400 ) Start tempering. Because this time is not no supercooled austenite into martensite, if heated, the result will be coarse ferrite compounds organization. Weld-induced contraction reaches a yield point of the local strain strain often several times larger than the strain caused by the load; ingot casting can damage tissue, grain refinement of steel, the microstructure and eliminate defects, so the steel dense tissue mechanical properties are improved. This improvement is mainly reflected in the direction along the rolling direction to a certain extent, the steel is no longer isotropic; pouring formed bubbles, cracks and loose, can be welded at a high temperature and pressure. Seamless steel deep processing deoxy packaging technology will move forward to meet the product requirements. So seamless steel pipe products smaller, faster, lighter, shorter product life cycles market, more I / O count and more dense spacing and higher operating frequencies, are pushing for the heating process requirements, which will Further making the necessary improvements and process control for device optimization.