Wireless Connectivity Module Technology Advances

Integrating a wireless connectivity module within the ultra slim electronics devices of the present has been quite a challenge for RF design experts. The traditional circuit board designs placed components next to each other. SiP technology has been developed over recent years which allows for components like wireless connectivity modules to be housed in a single package. These single packages can contain other components such as the antenna (AiP).

Components are stored vertically unlike before. This saves a lot of space and allows for smaller portable electronics devices to be produced. Even though the System-in-Package method stacks chips vertically, products can still be ultra thin as it is very rare for a package to exceed 2mm. Designing circuit boards in this way allows for larger batteries and better packaging of the overall product.

There are various types of wireless connectivity modules used in semiconductor design. The standard allows for 802.11g/b and Bluetooth connections as that is what the market demands. The technology in markets like mobile communications is always evolving and so new wireless modules are designed all of the time.

GSM and GPRS to 3G broadband connectivity have been the more recent developments which require new RF design concepts. The good news for makers of electronics devices is that new technologies can easily be integrated into the SiP approach. This is because having all components in one package is actually much easier then the previous approaches. When components were placed side by side it would often require additional testing by extra experts in each field.

Integrating wireless connectivity modules into new products is less complex than ever before. There are less wires used and space which also means less power is required. There is a much shorter time to market which is vital given the demand for ever changing products. Because the whole design process is less complex, costs are now lower too.