Wireless Modules and System in Package design

Designing circuit boards for electronic devices has become simpler in recent times thanks to System-in -Package technologies. Previously it was necessary to have many specialist engineers designing, testing, and liaising with each other throughout the design and development phase. System in Package technology is a much simpler type of RF circuit board design. It allows different components to be stacked vertically on top of each other, instead of next to each other.

Wireless modules can now easily be integrated into new products, and the cost of implementing this technology has been greatly reduced. There is always a design need for miniaturization, and the System in Package technology makes this possible. We definitely live in a wireless world, more and more products and appliances are integrating wireless modules.

These modules are packed into the circuit design which then free up many new functions. The most obvious and common use for these modules is in mobile phones. The demand for new models with new applications and functions is massive. Therefore it was necessary to develop SiP designed to incorporate very smart tools and components into one small package. Even the antenna can be housed in a single package with several other items.

Wireless modules are now being improved upon so they can be installed in a large array of electronic devices. Connecting a computer to a television is done with bulky HDMI cables presently. The technology though is now strong enough to wirelessly transfer high quality, large sized data through the airwaves. This has implications for many other electronic devices too. For example manufacturers of house appliances are likely to install wireless modules in the future. This will allow them to access their sold products to carry out diagnostics checks when a problem is reported.