Advantages of Silicon wafer Dicing

Silicon wafer dicing is one of the most popular   methods in the semiconductor industry. It is a procedure of separating a die from a wafer of semiconductor. This process is executed by  different methods like breaking, scribing, by laser cutting or by mechanical sawing. Silicon wafers are mounted on dicing tape so that when diced, the die will reside on the tape while machining until further steps . Subsequently, the blade crushes the wafer (substrate material) through the partition of dice and removes the produced debris at the same time. Material elimination occurs along fanatical dicing lines that are also known as streets, connecting the active areas of the dice. The dicing methods can be achieved by using different types of

The dicing methods can be achieved by using different types of silicon wafer dicing services. All procedures are usually automated to ensure high level of accuracy and precision. After the dicing process, every single silicon chip is encapsulated into chip carriers. Therefore, these chips are then ready to use in manufacturing of electronic devices such as computers, TVs etc. Contrasting earlier times, when people used to do heavy mechanical jobs all by themselves  using their hands, nowadays with the helping aid of advanced equipment and machines, there is no need of putting so much endeavor.

In ceramic industry, the workers in previous days used to slash the wafer with their hands by putting in so much  effort and time. However, in today’s world, Silicon wafer supplier industries offer a variety of methods and devices like wafer dicing machines, diamond scribing tools etc. These machines and processes have made not only machining but other services such as slicing, dicing etc. much easier.

Different Types of Silicon wafer dicing methods:

• Dry wafer Dicing Process: Leveraging patented technologies, such as scriber breaker systems can manage the exceptional requirements and miscellaneous applications of clientele that necessitate dry dicing die singulation for their high volume and high value devices. Dry Process wafer dicing is the finest solution for die singulation of high volume and high value devices such as laser MMIC’s, diodes, biomedical chips, silicon photonics chips and MEMS. The precision and meticulous diamond scribing system utilizes only 3-6 microns of the wafer street, allowing extra die per silicon wafer.

In addition, the exclusive and original breaking procedures provide accurate resources of die partition with negligible mechanical stress on the die and debris production. This process helps to ensure higher overall device yield, better quality die, and low expenditure of die singulation.

• DTX wafer dicing process: The DTX process is accessible as an automatic, fully integrated scriber breaker or as a mechanical breaker system. For materials such as Indium Phosphide (InP), Gallium Arsenide (GaAs), Gallium Nitride (GaN), and Silicon (Si), in wafer substrate sizes up to 300 mm, the DTX process can be performed by diamond scribe. This method can also be performed using break only die or break dry dicing. The separation of die can be accomplished by high aspect ratio etch, stealth laser, saw, and, scribed materials.
• GSX wafer dicing process: The GSX sequence of scriber breaker tools are factory redeveloped GST systems. The GSX has a latest set of amplifiers and controllers. It runs on the extremely advanced software known as Automatic Scriber Breaker platform. It is a cost effectual way to expand and boost the performance and life of existing GST systems. This method can also be performed using highly developed dry dicing solutions for Production programs and R&D, Pilot.